BR5001 Datasheet | EIC Semiconductor

FEATURES : - High case dielectric strength - High surge current capability - High reliability - High efficiency - Low reverse current - Low forward voltage drop - Rated isolation-voltage 2000 VAC - Pb / Ro HS Free MECHANICAL DATA : - Case : Molded plastic with heatsink integrally mounted in the bridge encapsulation - Epoxy : UL94V-0 rate flame retardant - Terminals : plated .25" (6.35 mm). Faston - Polarity : Polarity symbols marked on case - Mounting position : Bolt down on heat-sink with silicone thermal pound between bridge and mounting surface for maximum heat transfer efficiency. - Weight : 17.1 grams BR50 0.728(18.50) 0.688(17.40) 0.570(14.50) 0.530(13.40) 0.685(16.70) 1.137(28.90) 0.618(15.70) 1.114(28.30) 0.658(16.70) 0.618(15.70) 0.210(5.30) 0.200(5.10) 0.032(0.81) 0.028(0.71) 0.310(7.87) 0.280(7.11) 0.252(6.40) 0.248(6.30) φ 0.100(2.50) 0.090(2.30) 0.905(23.0) 0.826(21.0) Metal Heatsink Dimensions in inches and ( millimeters ) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Rating at 25 °C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20%. RATING Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Forward Current Tc = 55°C Peak Forward Surge Current Single half sine wave Superimposed on rated load (JEDEC...