D3SBA40 Datasheet | EIC Semiconductor

FEATURES : - High current .. - - - - - - - capability High surge current capability High reliability Low reverse current Low forward voltage drop Ideal for printed circuit board Very good heat dissipation Pb / Ro HS Free SILICON BRIDGE RECTIFIER 0.150 (3.8) 0.134 (3.4) 0.189 (4.8) 0.173 (4.4) C3 0.603(15.3) 0.579(14.7) + ~ ~ 0.383(9.7) 0.367(9.3) 0.130(3.7) 0.146(3.3) 0.043 (1.1) 0.035 (0.9) 0.709 (18) 0.669 (17) 0.075 (1.9) 0.060 (1.5) MECHANICAL DATA : - Case : Reliable low cost construction utilizing molded plastic technique - Epoxy : UL94V-O rate flame retardant - Terminals : Plated lead solderable per MIL-STD-202, Method 208 guaranteed - Polarity : Polarity symbols marked on case - Mounting position : Any - Weight : 4.28 grams 0.303 (7.7) 0.287 (7.3) 0.114 (2.9) 0.098 (2.5) 0.032 (0.8) 0.043 (1.1) Dimensions in inches and (millimeters) Rating at 25 °C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20%. MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS RATING Maximum Reverse Voltage Maximum Average Forward Current (50Hz Sine wave, R-load) Maximum Peak Forward Surge Current ( 50 Hz, Half-cycle, Sinwave, Single Shot ) Current Squared Time at 1ms ≤ t < 10 ms, Tc=25 °C Maximum Forward Voltage per Diode at I F = 2.0 A. Maximum DC Reverse Current, V R=VRM ( Pulse measurement, Rating of per diode) Maximum Thermal Resistance, Junction to case Maximum Thermal Resistance, Junction to Ambient Operating Junction Temperature Range Storage Temperature Range Page 1 of 2 SYMBOL V RM IF(AV) D3SBA D3SBA D3SBA D3SBA D3SBA 10 20 40 60 80 100 200 400 600 800 4 (With heatsink, Tc = 108 °C) 2.3 (Without heatsink, Ta = 25 °C) 80 32 1.05 10 5.5 (With heatsink) 30 (Without heatsink) 150 - 40 to + 150 0.134(3.4) 0.122(3.1) 0.996 (25.3) 0.972...