GN3D
GN3D is GLASS PASSIVATED JUNCTION SILICON SURFACE MOUNT manufactured by EIC Semiconductor.
FEATURES
:
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- Glass passivated chip High current capability High reliability Low reverse current Low forward voltage drop
GLASS PASSIVATED JUNCTION SILICON SURFACE MOUNT
SMC (DO-214AB)
1 .1 ± 0.3
± 0.15 ± 0.15
3.0 ± 0.2 0.2 ± 0.0 7
5.8 ± 0.15
2.3 ± 0.2
MECHANICAL DATA :
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- - Case : SMC Molded plastic Epoxy : UL94V-O rate flame retardant Lead : Lead Formed for Surface Mount Polarity : Color band denotes cathode end Mounting position : Any Weight : 0.21 gram
Dimensions in millimeter
Rating at 25 °C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20%.
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
RATING Maximum Repetitive Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Forward Current Ta = 75 °C Peak Forward Surge Current 8.3ms Single half sine wave Superimposed on rated load (JEDEC Method) Maximum Forward Voltage at IF = 3.0 Amps. Maximum DC Reverse Current at rated DC Blocking Voltage Ta = 25 °C Ta = 100 °C
SYMBOL GN3A VRRM VRMS VDC IF(AV) IFSM VF IR IR(H) CJ TJ TSTG 50 35 50
GN3B
GN3G
GN3J
GN3K
GN3M
UNIT V V V A A V µA µA p F °C °C
100 70 100
200 140 200
400 280 400 3.0 150 1.0 5.0 50 50
- 65 to + 175
- 65 to + 175
600 420 600
800 560 800
1000 700 1000
Typical Junction Capacitance (Note1) Junction Temperature Range Storage Temperature Range Notes :
(1) Measured at 1.0 MHz and applied reverse voltage of 4.0VDC
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