EDF1BM Datasheet | EIC Semiconductor

FEATURES : - Glass passivated chip junction - High forward surge current capability - Ideal for printed circuit boards - Superfast recovery times for high efficiency - High temperature soldering guaranteed: 260°C/10 seconds, at 5 lbs. (2.3kg) tension - Pb / Ro HS Free MECHANICAL DATA : - Case : Molded plastic - Epoxy : UL94V-O rate flame retardant - Terminals : Plated Lead solderable per MIL-STD-750, Method 2026 - Polarity : Polarity symbols marked on body - Mounting position : Any - Weight : 0.42 gram MINIATURE GLASS PASSIVATED ULTRAFAST BRIDGE RECTIFIERS 0.255(6.5) 0.245(6.2) ~~ 0.315(8.00) 0.285(7.24) 0.335(8.51) 0.320(8.12) 0.255(6.5) 0.245(6.2) 0.122(3.10) 0.100(2.60) 0.045(1.14) 0.035(0.89) 0.185(4.69) 0.150(3.81) 0.205(5.2) 0.195(5.0) 0.350(8.9) 0.300(7.6) 0.0130(0.33) 0.0086(0.22) Dimensions in inches and ( millimeters ) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Rating at 25°C ambient temperature...