EIC Semiconductor GN3J
GLASS PASSIVATED JUNCTION SILICON SURFACE MOUNT
FEATURES
: * * * * * Glass passivated chip High current capability High reliability Low reverse current Low forward voltage drop GLASS PASSIVATED JUNCTION SILICON SURFACE MOUNT SMC (DO-214AB) 1 .1 ± 0.3 ± 0.15 ± 0.15 8.0 3.0 ± 0.2 0.2 ± 0.0 7 5.8 ± 0.15 7.5 2.3 ± 0.2MECHANICAL DATA
: * * * * * * Case : SMC Molded plastic Epoxy : UL94V-O rate flame retardant Lead : Lead Formed for Surface Mount Polarity : Color band denotes cathode end Mounting position : Any Weight : 0.21 gram Dimensions in millimeter Rating at 25 °C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20%.MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
RATING Maximum Repetitive Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Forward Current Ta = 75 °C Peak Forward Surge Current 8.3ms Single half sine wave Superimposed on rated load (JEDEC Method) Maximum Forward Voltage at IF = 3.0 Amps.