P6KE56A Datasheet | EIC Semiconductor

FEATURES : - Glass passivated jungtion chip - 600W surge capability at 1ms - Excellent clamping capability - Low zener impedance - Fast response time : typically less then 1.0 ps from 0 volt to VBR(min.) - Typical IR less then 1m A above 10V - Moisture Sensitivity Level 1 (Unlimited) - Pb / Ro HS Free 0.142 (3.6) 0.102 (2.6) 0.034 (0.86) 0.028 (0.71) 1.00 (25.4) MIN. 0.300 (7.6) 0.230 (5.8) 1.00 (25.4) MIN. MECHANICAL DATA : - Case : DO-15 Molded plastic - Epoxy : UL94V-0 rate flame retardant - Lead : Axial lead solderable per MIL-STD-202, Method 208 guaranteed - Polarity : Color band denotes cathode end - Mounting position : Any - Weight : 0.4 gram Dimensions in inches and ( millimeters ) DEVICES FOR BIPOLAR APPLICATIONS For Bi-directional use C or CA Suffix Electrical characteristics apply in both directions MAXIMUM RATINGS Rating at 25 C ambient temperature unless otherwise specified. Rating Peak Power Dissipation at Ta = 25 °C, Tp=1ms (Note1) Steady State Power Dissipation at TL = 75 °C Lead Lengths 0.375", (9.5mm) (Note 2) Typical thermal resistance junction to lead (Note 3) Typical thermal resistance junction to ambient (Note 3) Operating and Storage Temperature Range Symbol RɵJL RɵJA TJ, TSTG Notes : (1) Non-repetitive Current pulse, per Fig. 2 and derated above Ta = 25 °C per Fig. 1 (2) Mounted on Copper Leaf area of 1.57 in2 (40mm2). (3) Thermal resistance from junction to ambient at 0.375" (9.6 mm) lead length, PCB mounted Page 1 of...