EIC Semiconductor SMBJ5376B
SURFACE MOUNT SILICON ZENER DIODES
FEATURES
: * High peak reverse power dissipation * High reliability * Low leakage current * Pb / RoHS FreeMECHANICAL DATA
* Case : SMB Molded plastic * Epoxy : UL94V-0 rate flame retardant * Lead : Lead Formed for Surface Mount * Polarity : Color band denotes cathode end * Mounting position : Any * Weight : 0.108 gram SMB (DO-214AA) 1.14 ± 0.38 0.203 MAX 5.4 ± 0.19 4.315 ± 0.255 2.0 ± 0.20 3.62 ± 0.32 2.28 ± 0.15 0.228 ± 0.07 Dimensions in millimetersMAXIMUM RATINGS
Rating at 25 °C ambient temperature unless otherwise specified Rating Power Dissipation at TL = 75 °C Maximum Forward Voltage at IF = 200 mA Thermal Resistance, Junction to Ambient (Note 1) Thermal Resistance, Junction to Lead (Note 1) Thermal Resistance, Junction to Case Operating and Storage Temperature Range Symbol PD VF RӨJA RӨJL RӨJC TJ, TSTG Note : (1) When mounted on FR4 PC board (1 oz Cu) with recommended footprint. Value 5 1.2 90 25 40 - 65 to + 150 Unit W V °C/W °C/W °C/W °C Fig. 1 POWER DERATING CURVE PD, MAXIMUM DISSIPATION (WATTS) Page 1 of 2 TL, LEAD TEMPERATURE (°C) Rev.