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SMBJ5381B Datasheet PDF

EIC Semiconductor SMBJ5381B

SURFACE MOUNT SILICON ZENER DIODES

Part No. SMBJ5381B
Datasheet SMBJ5381B Download
Manufacturer
EIC Semiconductor
Description SURFACE MOUNT SILICON ZENER DIODES
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SMBJ5381B datasheet page 1 preview

FEATURES

: * High peak reverse power dissipation * High reliability * Low leakage current * Pb / RoHS Free

MECHANICAL DATA

* Case : SMB Molded plastic * Epoxy : UL94V-0 rate flame retardant * Lead : Lead Formed for Surface Mount * Polarity : Color band denotes cathode end * Mounting position : Any * Weight : 0.108 gram SMB (DO-214AA) 1.14 ± 0.38 0.203 MAX 5.4 ± 0.19 4.315 ± 0.255 2.0 ± 0.20 3.62 ± 0.32 2.28 ± 0.15 0.228 ± 0.07 Dimensions in millimeters

MAXIMUM RATINGS

Rating at 25 °C ambient temperature unless otherwise specified Rating Power Dissipation at TL = 75 °C Maximum Forward Voltage at IF = 200 mA Thermal Resistance, Junction to Ambient (Note 1) Thermal Resistance, Junction to Lead (Note 1) Thermal Resistance, Junction to Case Operating and Storage Temperature Range Symbol PD VF RӨJA RӨJL RӨJC TJ, TSTG Note : (1) When mounted on FR4 PC board (1 oz Cu) with recommended footprint. Value 5 1.2 90 25 40 - 65 to + 150 Unit W V °C/W °C/W °C/W °C Fig. 1 POWER DERATING CURVE PD, MAXIMUM DISSIPATION (WATTS) Page 1 of 2 TL, LEAD TEMPERATURE (°C) Rev.
SMBJ5381B page 2 preview