EDFA164A1PF
EDFA164A1PF is manufactured by ELPIDA.
COVER
DATA SHEET
16Gb DDR3 Mobile RAMTM PoP (14.0mm × 14.0mm, 220-ball FBGA)
Specifications
- Density: 16Gb
- Organization
- 4 pieces of 4Gb (16M words × 32 bits × 8 banks) in one package
- Independent 2-channel bus
- Package
- 220-ball FBGA
- Package size: 14.0mm (X) × 14.0mm (Y)
- Ball pitch: 0.50mm
- Lead-free (RoHS pliant) and Halogen-free
- Power supply
- VDD1 = 1.70V to 1.95V
- VDD2, VDDCA, VDDQ = 1.14V to 1.30V
- Data rate: 1600Mbps max (RL = 12)
- Interface: HSUL_12
- Operating case temperature range
- TC =
- 30°C to +85°C
Block Diagram
Features
- Low power consumption
- Per Bank Refresh
- Partial Array Self-Refresh (PASR)
- Bank Masking
- Segment Masking
- Auto...
