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ESMT
DDR SDRAM
M13S128324A (2M)
Operation Temperature Condition -40°C~85°C
1M x 32 Bit x 4 Banks
Double Data Rate SDRAM
Features
Double-data-rate architecture, two data transfers per clock cycle Bi-directional data strobe (DQS) Differential clock inputs (CLK and CLK ) DLL aligns DQ and DQS transition with CLK transition Quad bank operation CAS Latency : 2, 2.5, 3 Burst Type : Sequential and Interleave Burst Length : 2, 4, 8 All inputs except data & DM are sampled at the rising edge of the system clock(CLK) Data I/O transitions on both edges of data strobe (DQS) DQS is edge-aligned with data for READs; center-aligned with data for WRITEs Data mask (DM) for write masking only VDD = 2.375V ~ 2.625V, VDDQ = 2.375V ~ 2.625V VDD = 2.5V ~ 2.7V, VDDQ = 2.5V ~ 2.