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M15T4G8512A-DEBG2S - 64M x 8 Bit x 8 Banks DDR3 SDRAM

Download the M15T4G8512A-DEBG2S datasheet PDF. This datasheet also covers the M15T4G8512A variant, as both devices belong to the same 64m x 8 bit x 8 banks ddr3 sdram family and are provided as variant models within a single manufacturer datasheet.

General Description

The 4Gb Double-Data-Rate-3 (DDR3(L)) DRAM is double data rate architecture to achieve high-speed operation.

It is internally configured as an eight-bank DRAM.

The 4Gb chip is organized as 64Mbit x 8 I/Os x 8 bank devices.

Key Features

  • and all of the control and address inputs are synchronized with a pair of externally supplied differential clocks. Inputs are latched at the cross point of differential clocks (CK rising and CK falling). All I/Os are synchronized with a differential DQS pair in a source synchronous fashion. These devices operate with a single 1.35V -0.067V/+0.1V or 1.5V ± 0.075V power supply and are available in BGA packages. DDR3(L) SDRAM Addressing Configuration 512Mb x 8 # of Bank 8 Bank Address BA0.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (M15T4G8512A-ESMT.pdf) that lists specifications for multiple related part numbers.

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
ESMT DDR3(L) SDRAM Feature  Interface and Power Supply ˗ SSTL_135: VDD/VDDQ = 1.35V(-0.067V/+0.1V) ˗ SSTL_15: VDD/VDDQ = 1.5V(±0.