3D7501
FEATURES
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- - All-silicon, low-power CMOS technology TTL/CMOS patible inputs and outputs Vapor phase, IR and wave solderable Auto-insertable (DIP pkg.) Low ground bounce noise Maximum data rate: 50 MBaud data 3 ® delay devices, inc.
PACKAGES
CLK N/C N/C 1 2 3 4 5 6 7 14 13 12 11 10 9 8 VDD N/C N/C N/C N/C TXB TX
CLK RESB DAT GND 3D7501M 3D7501H 3D7501Z
1 2 3 4
8 7 6 5
VDD N/C TXB TX
RESB DAT N/C GND
DIP (.300) Gull Wing (.300) SOIC (.150)
3D7501 DIP (.300) 3D7501G Gull Wing (.300) 3D7501D SOIC (.150)
FUNCTIONAL DESCRIPTION
The 3D7501 is a monolithic CMOS Manchester Encoder. The clock and data, present at the unit input, are bined into a single biphase-level signal. In this encoding mode, a logic one is represented by a high-to-low transition within the bit cell, while a logic zero is represented by a low-to-high transition. The unit operating baud rate (in Mbaud) is equal to the input clock frequency (in MHZ) . All pins marked N/C must be left unconnected.
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