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Thermal Data
DIP 20
20 leads PACKAGE MATERIAL LIST
item # material thickness thermal conductivity 2.61 W/cm°C 0.01 W/cm°C
leadframe die attach
copper epoxy glue ( silver glue ) epoxy resin
0.25 mm 10-40 µm
molding compound
3 mm
0.0063W/cm°C
Typical assembly configuration before molding :
Charts enclosed : 1) Rth(j-a) vs power dissipation 2) Zth(j-a) vs time width and die size
February 1998 1/2
Thermal Data
DIP 20
Rth(j-a) (ºC/W)
120
copper frame thickness = 0.25 mm die pad = 125 x 160 sq.mils die size = 10.000 sq.mils
1)
100
floating in air
80
mounted on board
60
0
0.2
0.4
0.6
0.8
1 1.2 1.4 1.6 dissipated power ( Watt )
1.8
2
2.2
2.4
Transient Thermal Resistance (ºC/W) 100
copper frame thickness = 0.25 mm die pad = 110 x 120 sq.
DIP20 Datasheet
