DIP20 Description
® Thermal Data DIP 20 20 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity 2.61 W/cm°C 0.01 W/cm°C leadframe die attach copper epoxy glue ( silver glue ) epoxy resin 0.25 mm 10-40 µm molding pound 3 mm 0.0063W/cm°C Typical assembly configuration before molding.