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KVR533D2S8F4 - Memory Module Specifications

Datasheet Summary

Description

This document describes ValueRAM's 512MB (64M x 72-bit) PC2-4200 CL4 SDRAM (Synchronous DRAM) "fully buffered" ECC "single rank" “Intel Certified” memory module.

This module is based on nine 64M x 8-bit 533MHz DDR2 FBGA components.

The module also includes an AMB device (Advanced Memory Buffer).

Features

  • on future card designs and if it does, will be included in this specification at that time. 1 Total DNU/M_Test 1 240 1. System Clock Signals SCK and SCK switch at one half the DRAM CK/CK frequency 2. Eight pins reserved for forwarded clocks, eight pins reserved for future architecture flexibility Absolute Maximum Ratings Symbol VIN, VOUT VCC VDD VTT TSTG TCASE Parameter Voltage on any pin relative to V Voltage V DD pin relative to Vss Voltage on V TT pin relative to V SS Storage temperature.

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Datasheet Details

Part number KVR533D2S8F4
Manufacturer ETC
File Size 216.56 KB
Description Memory Module Specifications
Datasheet download datasheet KVR533D2S8F4 Datasheet
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www.DataSheet4U.com Memory Module Specifications KVR533D2S8F4/512I 512MB 64M x 72-Bit PC2-4200 CL4 ECC 240-Pin FBDIMM Description: This document describes ValueRAM's 512MB (64M x 72-bit) PC2-4200 CL4 SDRAM (Synchronous DRAM) "fully buffered" ECC "single rank" “Intel Certified” memory module. This module is based on nine 64M x 8-bit 533MHz DDR2 FBGA components. The module also includes an AMB device (Advanced Memory Buffer). The electrical and mechanical specifications are as follows: Feature: · · · · · · · · · · · · · FBDIMM Module: 240-pin JEDEC Standard: R/C A Memory Organization: 1 rank of x8 devices DDR2 DRAM Interface: SSTL_18 DDR2 Speed Grade: 533 Mbps CAS Latency: 4-4-4 Module Bandwidth: 4.2 GB/s DRAM: VDD = VDDQ = 1.8V AMB: VCC = VCCFBD = 1.5V EEPROM: VDDSPD = 3.
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