WEDPNF8M721V-1010BI - 8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package

This page provides the datasheet information for the WEDPNF8M721V-1010BI, a member of the WED 8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package family.

Datasheet Summary

Description

The 64MByte (512Mb) SDRAM is a high-speed CMOS, dynamic random-access ,memory using 5 chips containing 134, 217, 728 bits.

Each chip is internally configured as a quad-bank DRAM with a synchronous interface.

Features

S n n n Package:.
275 Plastic Ball Grid Array (PBGA), 32mm x 25mm Commercial, Industrial and Military Temperature Ranges Weight:.
WEDPNF8M721V-XBX - 2.5 grams typical n n n n Sector Architecture.
One 16KByte, two 8KBytes, one 32KByte, and fif teen 64KBytes in byte mode.
One 8K word, two 4K words, one 16K word, and fifteen 32K word sectors in word mode.
Any combination of sectors can be concurrently erased. Also supports full chip erase Boot Code Sect.

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WEDPNF8M721V-1010BI 8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package by ETC - Datasheet Preview — Datasheet preview – WEDPNF8M721V-1010BI

Datasheet Details

Part number	WEDPNF8M721V-1010BI
Manufacturer	ETC
File Size	1.25 MB
Description	8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package
Datasheet	WEDPNF8M721V-1010BI Datasheet
Additional preview pages of the WEDPNF8M721V-1010BI datasheet.

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Other Datasheets by ETC

WEDPNF8M721V-1010BC - 8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package
WEDPNF8M721V-1010BM - 8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package
WEDPNF8M721V-1012BC - 8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package
WEDPNF8M721V-1012BI - 8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package
WEDPNF8M721V-1012BM - 8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package
WEDPNF8M721V-1015BC - 8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package
WEDPNF8M721V-1015BI - 8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package
WEDPNF8M721V-1015BM - 8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package

Full PDF Text Transcription

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White Electronic Designs WEDPNF8M721V-XBX 8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package ADVANCED* FEATURES n n n Package: • 275 Plastic Ball Grid Array (PBGA), 32mm x 25mm Commercial, Industrial and Military Temperature Ranges Weight: • WEDPNF8M721V-XBX - 2.5 grams typical n n n n Sector Architecture • One 16KByte, two 8KBytes, one 32KByte, and fif teen 64KBytes in byte mode • One 8K word, two 4K words, one 16K word, and fifteen 32K word sectors in word mode. • Any combination of sectors can be concurrently erased.

Published: Apr 17, 2005 |