WS512K32-XXX
Key Features
- Access Times of 15*, 17, 20, 25, 35, 45, 55ns
- Packaging 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP (Package 400). 68 lead, 40mm Hermetic Low Profile CQFP, 3.5mm (0.140") (Package 502)1, Package to be developed. 68 lead, Hermetic CQFP (G2T)1, 22.4mm (0.880") square (Package 509) 4.57mm (0.180") height. Designed to fit JEDEC 68 lead 0.990" CQFJ footprint (Fig. 3). 68 lead, Hermetic CQFP (G1U), 23.9mm (0.940") square (Package 519) 3.57mm (0.140") height. Designed to fit JEDEC 68 lead 0.990" CQFJ footprint (Fig. 3). 68 lead, Hermetic CQFP (G1U), 23.9mm (0.940") square (Package 524) 4.06mm (0.160") height.
- Organized as 512Kx32, User Configurable as 1Mx16 or 2Mx8
- Commercial, Industrial and Military Temperature Ranges
- TTL Compatible Inputs and Outputs
- 5 Volt Power Supply
- Low Power CMOS
- Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation
- Weight WS512K32-XH1X - 13 grams typical WS512K32-XG2TX1 - 8 grams typical WS512K32-XG1UX - 5 grams typical WS512K32-XG1TX - 5 grams typical WS512K32-XG4TX1 - 20 grams typical
- 15ns Access Time available only in Commercial and Industrial Temperature. This speed is not fully characterized and is subject to change without notice. Note 1: Package Not Recommended For New Design FIG. 1
