DESCRIPTION
ETERTEC® HT-115 dry film photoresist is an aqueous processable alkaline developable, negative acting photoresist designed for print-and-etch, plating, and tent- and-etch applications. SPECIFICATION Film Type Thickness(µm) Color(unexposed) (exposed) Recommended uses ETERTEC® 40 ± 2 Green Blue Plating Tent-and-Etch General procedures follow: 1. Clean copper clad laminate with an automatic scrubbing machine, scrubs manually with acid pumice slurry, or chemically cleans. 2. Water rinse. 3. 10 -15% sulfuric acid rinse. 4. Water rinse. 5. Blow-dry with clean, oil free air. 6. Oven dries at 40 - 65℃. 1 DFR0009 Process Note: Several other cleaning methods work acceptably for the ETERTEC HT-100 SERIES PHOTORESIST such as jet pumice scrubbers, Scotch Brite, aluminum oxide spray, pumice brushing, and chemical cleaning. LAMINATION: Recommended parameters Roll temperature Roll speed Air assist pressure Exit temperature 100〜1200 C (210〜2500 F) 1.0〜3.0m/min (3〜10feet/min) 35〜50psi 40〜650 C (105〜1500 F) Process Note: After lamination, panels should be racked with spaces between each panel.
