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EOC-20 - High Power Chipled

Features

  • Directive characteristic Size Soldering patterns Technology Tape & Reel Grouping parameter ESD resistance voltage Assembly methods Soldering methods 110° (optional with lens 40°) 3.2 (L) x 2.8 (W) Gold plated AlInGaP, InGaN 8 mm blister tape with 2000pcs. /reel Ø 180mm or 8000 pcs. /reel Ø 330mm sorted into luminous intensity groups, color groups or color coordinates up to 2 kV Suitable for all SMT assembly methods IR reflow soldering and TTW soldering.

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Datasheet Details

Part number EOC-20
Manufacturer Elcos AG
File Size 161.22 KB
Description High Power Chipled
Datasheet download datasheet EOC-20 Datasheet

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AG Luitpoldstr. 6 D-85276 Pfaffenhofen High Power Chipled - EOC - 20 Series Preliminary Data Features Directive characteristic Size Soldering patterns Technology Tape & Reel Grouping parameter ESD resistance voltage Assembly methods Soldering methods 110° (optional with lens 40°) 3.2 (L) x 2.8 (W) Gold plated AlInGaP, InGaN 8 mm blister tape with 2000pcs./reel Ø 180mm or 8000 pcs.
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