HB52E649E12-B6B Description
The HB52E649E12 belongs to 8-byte DIMM (Dual In-line Memory Module) family, and has been developed as an optimized main memory solution for 8-byte processor applications. An outline of the HB52E649E12 is 168-pin socket type package (dual lead out). Therefore, the HB52E649E12 makes high density mounting possible without surface mount technology.
HB52E649E12-B6B Key Features
- Fully patible with : JEDEC standard outline 8-byte DIMM : Intel PCB Reference design (Rev.1.2)
- 168-pin socket type package (dual lead out) Outline: 133.37 mm (Length) × 43.18 mm (Height) × 4.00 mm (Thickness) Le
- 3.3 V power supply
- Clock frequency: 100 MHz (max)
- LVTTL interface
- Data bus width: × 72 ECC
- Single pulsed RAS
- 4 Banks can operates simultaneously and independently
- Burst read/write operation and burst read/single write operation capability
- Programmable burst length: 1/2/4/8
HB52E649E12-B6B Applications
- Fully patible with : JEDEC standard outline 8-byte DIMM : Intel PCB Reference design (Rev.1.2)