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EDB4064B3PB - 4G bits DDR2 Mobile RAM

Features

  • JEDEC LPDDR2-S4B compliance.
  • DLL is not implemented.
  • Low power consumption.
  • Mobile RAM functions.
  • Partial Array Self-Refresh (PASR).
  • Auto Temperature Compensated Self-Refresh (ATCSR) by built-in temperature sensor.
  • Deep power-down mode.
  • Per Bank Refresh.
  • This FBGA is suitable for Package on Package (PoP) Block Diagram VDD1 VDD2 VDDQ VREFCA_a, VREFCA_b VREFDQ_a, VREFDQ_b VSS CK_a, /CK_a CA0_a to.

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Datasheet preview – EDB4064B3PB

Datasheet Details

Part number EDB4064B3PB
Manufacturer Elpida
File Size 130.79 KB
Description 4G bits DDR2 Mobile RAM
Datasheet download datasheet EDB4064B3PB Datasheet
Additional preview pages of the EDB4064B3PB datasheet.

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Full PDF Text Transcription

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DATA SHEET 4G bits DDR2 Mobile RAM™ PoP (12mm × 12mm, 216-ball FBGA) EDB4064B3PB Specifications • Density: 4G bits • Organization — 2 pieces of 2Gb (8M words × 32 bits × 8 banks) in one package — Independent 2-channel bus • Data rate: 1066Mbps (max.) • Package: 216-ball FBGA — Package size: 12.0mm × 12.0mm — Ball pitch: 0.4mm — Lead-free (RoHS compliant) and Halogen-free • Power supply — VDD1 = 1.70V to 1.95V — VDD2, VDDQ = 1.14V to 1.
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