EM640FV16FW
EM640FV16FW is 256K x16 bit Low Power and Low Voltage Full CMOS Static RAM manufactured by Emerging Memory - Logic Solutions.
FEATURES
- Process Technology : 0.18µm Full CMOS
- Organization :256K x16
- Power Supply Voltage => EM640FV16FW : 2.7~3.6V
- Three state output and TTL patible
- Packaged product designed for 55/70ns GENERAL PHYSICAL SPECIFICATIONS
- Backside die surface of polished bare silicon
- Typical Die Thickness = 725um
- Typical top-level metalization : => Metal ( Ti/Ti N/Al-Cu 0.5% ) : 5.7K Angstroms thickness
- Topside Passivation : => 7K Angstroms PE-Si N
- Typical Pad Size : 90.0um x 80.0um
- Wafer diameter : 8 inch OPTIONS
- C1/W1 : DC Probed Die/Wafer @ Hot Temp
- C2/W2 : DC/AC Probed Die/Wafer @ Hot Temp
PAD DESCRIPTIONS
Name CS1, CS2 OE WE A0~A17 I/O1~I/O16 Function Chip select inputs Output Enable input Write Enable input Address Inputs Data Inputs/Outpus Name Vcc Vss UB LB
- NC Function Power Supply Ground Upper Byte (I/O9~16) Lower Byte (I/O1~8) No Connection
EM640FV16FW Series
Low Power, 256Kx16 SRAM
FUNCTIONAL SPECIFICATIONS
There are 3 classifications for EMLSI die and wafers products, which are C1 and C2 for die and W1 and W2 for wafer, respectively. Each die and wafer support dedicated charateristics and probe the eletrical parameters within their specifications. Followings are brief information for die and wafer classifications. Please refer to packaged specifications for more information but these parameters are not guaranteed at bare die and wafer.
- C1 LEVEL DIE OR W1 LEVEL WAFER The DC parameters are measured by specification for C1 level die or W1 level wafer. The DC parameters measured at 70°C temperature, which called ‘Hot DC Sorting’ Other parameters are not guaranteed and warranted including device reliability. Please refer to qualification report for device reliability and package level datasheets for electrical parameters.
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- C2 LEVEL DIE OR W2 LEVEL WAFER The DC parameters and selected AC parameters are measured with for C2 level die or W2 level wafer. The DC characteristics of C2 die and W2 wafer is tested based on DC specifications of C1...
