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INTRODUCTION
PACKAGE MECHANICAL SPECIFICATIONS AND PARAMETERS
1. Parameter Definitions:
A = Distance from top of chip to top of glass. a = Photodiode Anode. B = Distance from top of glass to bottom of case. c = Photodiode Cathode (Note: cathode is common to case in metal package products unless otherwise noted). W = Window Diameter. F.O.V. = Filed of View (see definition below). 2. Dimensions are in inches (1 inch = 25.4 mm). 3. Pin diameters are 0.018 ± 0.001" unless otherwise specified. 4. Tolerances (unless otherwise noted) General: 0.XX ± 0.01" 0.XXX ± 0.005" ± 0.010" ± 0.015"
Chip Centering: Dimension `A': 5. Windows
All `UV' Enhanced products are provided with QUARTZ glass windows, 0.027 ± 0.002" thick. All `XUV' products are provided with removable windows.
APD032 Datasheet
