APD032 - PACKAGE MECHANICAL SPECIFICATIONS AND PARAMETERS

Datasheet Details

Part number	APD032
Manufacturer	Etc
File Size	76.77 KB
Description	PACKAGE MECHANICAL SPECIFICATIONS AND PARAMETERS
Datasheet	APD032 Datasheet
Additional preview pages of the APD032 datasheet.

📁 Similar Datasheet

APD0505-000 - Silicon PIN Diode Bondable Chips (Skyworks)
APD0505-203 - Silicon PIN Diode Devices (Skyworks)
APD0505-210 - Silicon PIN Diode Devices (Skyworks)
APD0505-219 - Silicon PIN Diode Devices (Skyworks)
APD0505-240 - Silicon PIN Diode Devices (Skyworks)
APD050A - InGaAs Photodiode (CETC)
APD0510-000 - Silicon PIN Diode Bondable Chips (Skyworks)
APD0510-203 - Silicon PIN Diode Devices (Skyworks)
APD0510-210 - Silicon PIN Diode Devices (Skyworks)
APD0510-219 - Silicon PIN Diode Devices (Skyworks)

Other Datasheets by Etc

Full PDF Text Transcription

Click to expand full text

INTRODUCTION PACKAGE MECHANICAL SPECIFICATIONS AND PARAMETERS 1. Parameter Definitions: A = Distance from top of chip to top of glass. a = Photodiode Anode. B = Distance from top of glass to bottom of case. c = Photodiode Cathode (Note: cathode is common to case in metal package products unless otherwise noted). W = Window Diameter. F.O.V. = Filed of View (see definition below). 2. Dimensions are in inches (1 inch = 25.4 mm). 3. Pin diameters are 0.018 ± 0.001" unless otherwise specified. 4. Tolerances (unless otherwise noted) General: 0.XX ± 0.01" 0.XXX ± 0.005" ± 0.010" ± 0.015" Chip Centering: Dimension `A': 5. Windows All `UV' Enhanced products are provided with QUARTZ glass windows, 0.027 ± 0.002" thick. All `XUV' products are provided with removable windows.

Published: Apr 23, 2005 |