EHP-B05 Description
DATASHEET EHP- B05 Series EHP-B05 series Introduction B05 series to be a high power, multi-chip device with very low as a result of the PCB substrate. The series is a surface-mount high-power device featuring high brightness that is suitable for all kinds of lighting applications such as general illumination, spot, signal, industrial and mercial lighting.
EHP-B05 Key Features
- Small package with high efficiency
- ESD protection up to 8KV
- Soldering method: SMT
- Binning Parameters: Brightness, Forward Voltage ,Wavelength and Chromaticity
- Moisture Sensitivity Level: 3
- RoHS pliant
- Matches ANSI binning
- Reliability testing conforms to IESNA LM80 Lumen maintenance test method 1 Revision