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CR10 - Ceramic Chip SMD

General Description

The solder pads provide an excellent heat sink.

For multi-chip arrays just choose 2 or more CERLEDs and mount them side by side or even antiparallel.

Small true chip - LED to build custom configurations.

Key Features

  • Solid state ceramic chip Surface mounting device High thermal conductivity Superior light uniformity End - to - end and side - to - side stackable down to a pitch of 1.3 mm Solder pads conform with Mil-Std 883 B Ideal for data transmission www. excelitas. com Maximum Ratings at 25° C Power dissipation Derating linear Peak forward current Continuous forward current Junction temperature Storage temperature Operating temperature Soldering temperature Ptot IFSM (10 µs) IF Tj Tst Top Tsold (10 s).

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Datasheet Details

Part number CR10
Manufacturer Excelitas
File Size 294.27 KB
Description Ceramic Chip SMD
Datasheet download datasheet CR10 Datasheet

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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CERLED Ceramic Chip SMD SMD - Wide-Viewing Angle CR 10 IRDA infrared Description The solder pads provide an excellent heat sink. For multi-chip arrays just choose 2 or more CERLEDs and mount them side by side or even antiparallel. Small true chip - LED to build custom configurations. Available on special order in 8 mm blister tape or solid strips of up to 12 pcs with a true pitch of 1.27 mm. Features and Benefits Solid state ceramic chip Surface mounting device High thermal conductivity Superior light uniformity End - to - end and side - to - side stackable down to a pitch of 1.3 mm Solder pads conform with Mil-Std 883 B Ideal for data transmission www.excelitas.