1N5401GP Datasheet PDF

FEATURES

• Glass passivated chip junction • Hyperectifier structure for high reliability • Cavity-free glass-passivated junction • Low forward voltage drop • Low leakage current, typical IR less than 0.1 µA • High forward surge capability • Solder dip 260ºC, 10s • Component in accordance to RoHS 2011/65/EU and WEEE 2002/96/EC

MECHANICAL DATA

• Case: DO-201AD (DO-27). Epoxy meets UL 94V-0 flammability rating. • Polarity: Color band denotes cathode end • Terminals: Matte tin plated leads, solderable per MIL-STD-750 Method 2026, J-STD-002 and JESD22-B102. Consumer grade, meets JESD 201 class 1A whisker test.

TYPICAL APPLICATIONS

Used in general purpose rectification of power supplies, inverters, converters and freewheeling diodes application Maximun Ratings and

ELECTRICAL CHARACTERISTICS

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