Overview: FMN4xT2TCK-25Ix Datasheet Stacked Multi-Chip Product(MCP) FMN4xT2TCK-25Ix Datasheet • Do not leave this document unattended. • This information contained in this document covered by
the non-discloser agreement. • Do not reproduce this document. • This document is property of Fidelix Co., Ltd. and
maybe be required to be returned at any time. Fidelix Co., Ltd. Revision 0.3 Jun. 2015 FMN4xT2TCK-25Ix Datasheet Stacked Multi-Chip Product(MCP) Document Title Stacked Multi-Chip Product (NAND=4G, LPDDR2=2G) Revision History Revision No. History 0.0 Initial Draft 0.1 Revised IDD Specification of DRAM 0.2 Revised IDD Specification of DRAM 0.3 Revised Package Dimension (8.0mm X 10.5mm) Draft date Nov. 1st, 2014 Nov. 4th, 2014 Mar. 24th, 2015 Jun. 2nd, 2015 Remark Preliminary
Final 1 Revision 0.3
Jun. 2015 FMN4xT2TCK-25Ix Datasheet Stacked Multi-Chip Product(MCP) Stacked Multi-Chip Product(MCP) 1.8V NAND Flash Memory and Mobile DDR2 1.
