NCLD3B1256M32 Overview
Key Features
- Operation Temperature
- (-25)oC ~ 70 oC
- 178-ball FBGA
- 12.0x11.5mm2, 1.00t, 0.65mm pitch
- Lead & Halogen Free 8Gb,16Gb: 178-Ball, LPDDR3 SDRAM [ LPDDR3 ]
- VDD2, VDDCA and VDDQ = 1.2V (1.14V to 1.30)
- HSUL_12 interface (High Speed Unterminated Logic 1.2V)
- Double data rate architecture for command, address and data Bus
- all control and address except CS_n, CKE latched at both rising and falling edge of the clock
- CS_n, CKE latched at rising edge of the clock
