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EGP20J - 2.0A Glass-Passivated High-Efficiency Rectifiers

Download the EGP20J datasheet PDF. This datasheet also covers the EGP20A variant, as both devices belong to the same 2.0a glass-passivated high-efficiency rectifiers family and are provided as variant models within a single manufacturer datasheet.

Key Features

  • Glass-Passivated Cavity-Free Junction.
  • High Surge Current Capability.
  • Low Leakage Current.
  • Super-Fast Recovery Time for High Efficiency.
  • Low Forward Voltage, High Current Capability DO-15 Glass case COLOR BAND.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (EGP20A-FairchildSemiconductor.pdf) that lists specifications for multiple related part numbers.

📁 Similar Datasheet

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EGP20J SINTERED GLASS PASSIVATED JUNCTION HIGH EFFICIENT RECTIFIER Zowie Technology
EGP20J 2.0A Rectifiers ON Semiconductor
EGP20J Glass Passivated High Efficient Plastic Rectifiers Taiwan Semiconductor

Other Datasheets by Fairchild (now onsemi)

Part Number Description
EGP20A 2.0A Glass-Passivated High-Efficiency Rectifiers
EGP20B 2.0A Glass-Passivated High-Efficiency Rectifiers
EGP20C 2.0A Glass-Passivated High-Efficiency Rectifiers
EGP20D 2.0A Glass-Passivated High-Efficiency Rectifiers
EGP20F 2.0A Glass-Passivated High-Efficiency Rectifiers

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
EGP20A - EGP20K — 2.0 A Glass-Passivated High-Efficiency Rectifiers June 2013 EGP20A - EGP20K 2.0 A Glass-Passivated High-Efficiency Rectifiers Features • Glass-Passivated Cavity-Free Junction • High Surge Current Capability • Low Leakage Current • Super-Fast Recovery Time for High Efficiency • Low Forward Voltage, High Current Capability DO-15 Glass case COLOR BAND DENOTES CATHODE Absolute Maximum Ratings(1) Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be opera- ble above the recommended operating conditions and stressing the parts to these levels is not recommended. In addi- tion, extended exposure to stresses above the recommended operating conditions may affect device reliability.