FDZ663P
Overview
Max rDS(on) = 134 mΩ at VGS = -4.5 V, ID = -2 A Max rDS(on) = 171 mΩ at VGS = -2.5 V, ID = -1.5 A Max rDS(on) = 216 mΩ at VGS = -1.8 V, ID = -1 A Max rDS(on) = 288 mΩ at VGS = -1.5 V, ID = -1 A Occupies only 0.64 mm2 of PCB area. Less than 16% of the area of 2 x 2 BGA Ultra-thin package: less than 0.4 mm height when mounted to PCB RoHS Compliant Designed on Fairchild's advanced 1.5 V PowerTrench® process with state of the art "fine pitch" Thin WLCSP packaging process, the FDZ663P minimizes both PCB space and rDS(on).
