RMPA0966 Datasheet (PDF) Download
Fairchild Semiconductor
RMPA0966

Description

The RMPA0966 Power Amplifier Module (PAM) is Fairchild’s latest innovation in 50 Ohm matched, surface mount modules targeting Cellular CDMA/WCDMA/HSDPA, AMPS and Wireless Local Loop (WLL) applications.

Key Features

  • 42% CDMA/WCDMA efficiency at +28 dBm Pout
  • 21% CDMA/WCDMA efficiency (56 mA total current) at +16 dBm Pout
  • Meets HSDPA performance requirements
  • 50% AMPS mode efficiency at +31 dBm Pout
  • Low quiescent current (Iccq): 15 mA in low-power mode
  • Single positive-supply operation with low power and shutdown modes
  • 3.4V typical Vcc operation
  • pact Lead-free pliant LCC package – (4.0 X 4.0 x 1.0 mm nominal)
  • Industry standard pinout
  • Internally matched to 50 Ohms and DC blocked RF input/output