FP100 Description
AND APPLICATIONS DIE SIZE: 16.5 x 16.5 mils (420 x 420 µm) DIE THICKNESS: 3.9 mils (100 µm typ.) BONDING PADS:.
FP100 Key Features
- 14 dBm P-1dB at 12 GHz
- 9 dB Power Gain at 12 GHz
- 3.0 dB Noise Figure at 12 GHz
- DESCRIPTION AND
- Part: FP100
- Manufacturer: Filtronic Compound Semiconductors
- Size: 32.67 KB
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