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Preliminary Data Sheet
• FEATURES ♦ 21 dBm Output Power at 1-dB Compression at 18 GHz ♦ 12.5 dB Power Gain at 18 GHz ♦ 55% Power-Added Efficiency ♦ Source Vias to Backside Metallization
FPDA200V
HIGH PERFORMANCE PHEMT WITH SOURCE VIAS
GATE BOND PAD
DRAIN BOND PAD
DIE SIZE: 15.6X13.2 mils (395x335 µm) DIE THICKNESS: 3.9 mils (100 µm) BONDING PADS: 3.1X3.1 mils (80x80 µm)
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DESCRIPTION AND APPLICATIONS The FPDA200V is an Aluminum Gallium Arsenide / Indium Gallium Arsenide (AlGaAs/InGaAs) Pseudomorphic High Electron Mobility Transistor (PHEMT), utilizing an Electron-Beam directwrite 0.25 µm by 200 µm Schottky barrier gate. The recessed “mushroom” gate structure minimizes parasitic gate-source and gate resistances.