FFM104
Key Features
- Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance
- Low profile surface mounted application in order to optimize board space
- High current capability
- Fast switching for high efficiency
- High surge current capability
- Glass passivated chip junction
- Lead-free parts meet RoHS requirements
- Suffix "-H" indicates Halogen-free parts, ex. FFM101-H Package outline SMA
- 196(4.9) 0.180(4.5)
- 012(0.3) Typ.
