Formosa MS FM3100-B
Chip Schottky Barrier Diodes
FEATURES
Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. For surface mounted applications. 0.142(3.6) 0.126(3.2) Exceeds environmental standards of MIL-S-19500 / 228 Low leakage current. 0.173(4.4) 0.157(4.0) 0.075(1.9) 0.067(1.7) 0.040(1.0) Typ. 0.040 (1.0) Typ. Mechanical data Case : Molded plastic, JEDEC DO-214AA Terminals : Solder plated, solderable per MIL-STD-750, Method 2026 Polarity : Indicated by c athode band Mounting P osition : Any Weight : 0.00878 ounce, 0.293 gram Dimensions in inches and (millimeters)MAXIMUM RATINGS
(AT TA=25oC unless otherwise noted) PARAMETER Forward rectified current Forward surge current See Fig.1 8.3ms single half sine-wave superimposed on rate load (JEDEC methode) VR = VRRM TA = 25o C CONDITIONS Symbol IO IFSM MIN. TYP. MAX. 3.0 80 0.5 20 Rq JA CJ TSTG -55 55 250 +150 o UNIT A A mA mA C / w pF o Reverse current Thermal resistance Diode junction capacitance Storage temp...