• Part: HFM307
  • Description: Chip Silicon Rectifier
  • Manufacturer: Formosa MS
  • Size: 70.71 KB
Download HFM307 Datasheet PDF
Formosa MS
HFM307
Features Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding pound. For surface mounted applications. Exceeds environmental standards of MIL-S-19500 / 228 Low leakage current. 0.032(0.8) Typ. 0.040(1.0) Typ. 0.152(3.8) 0.144(3.6) 0.189(4.8) 0.173(4.4) 0.244(6.2) 0.228(5.8) 0.087(2.2) 0.071(1.8) Mechanical data Case : Molded plastic, JEDEC DO-214AB Terminals : Solder plated, solderable per MIL-STD-750, Method 2026 Polarity : Indicated by c athode band Mounting P osition : Any Weight : 0.00585 ounce, 0.195 gram 0.040 (1.0) Typ. Dimensions in inches and (millimeters) MAXIMUM RATINGS (AT TA=25o C unless otherwise noted) PARAMETER Forward rectified current Forward surge current CONDITIONS Ambient temperature = 55 C 8.3ms single half sine-wave superimposed on rate load (JEDEC methode) VR = VRRM TA = 25o C o Symbol IO IFSM MIN. TYP. MAX. 3.0 100 10.0 300 UNIT A A u A u A o Reverse current Thermal resistance Diode...