Formosa MS SFM31
Chip Silicon Rectifier
FEATURES
Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. For surface mounted applications. Exceeds environmental standards of MIL-S-19500 / 228 Low leakage current. Mechanical data Case : Molded plastic, JEDEC DO-214AB Terminals : Solder plated, solderable per MIL-STD-750, Method 2026 Polarity : Indicated by c athode band Mounting Position : Any Weight : 0.00585 ounce, 0.195 gram 0.152(3.8) 0.144(3.6) 0.032(0.8) Typ. 0.040(1.0) Typ. SMC 0.276(7.0) 0.260(6.6) 0.244(6.2) 0.228(5.8) 0.012(0.3) Typ. 0.189(4.8) 0.173(4.4) 0.087(2.2) 0.071(1.8) 0.040 (1.0) Typ. Dimensions in inches and (millimeters)MAXIMUM RATINGS
(AT TA=25oC unless otherwise noted) PARAMETER CONDITIONS Forward rectified current Ambient temperature = 50oC Forward surge current Reverse current Thermal resistance Diode junction capacitance Storage temperature 8.3ms single half sine-wave superimposed on rate load (JEDEC methode) VR = VRRM TA = 25oC VR = VRRM TA = 100oC Junction to ambient f=1MHz and applied 4vDC reverse voltage Symbol IO IFSM IR RqJA CJ TSTG MIN. -55 TYP.