Formosa MS SL14
Low VF Chip Schottky Barrier Diodes
FEATURES
Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. For surface mounted applications. Exceeds environmental standards of MIL-S-19500 / 228 Low leakage current. Mechanical data Case : Molded plastic, JEDECDO-214AC Terminals : Solder plated, solderable per MIL-STD-750, Method 2026 Polarity : Indicated by c athode band Mounting Position : Any Weight : 0.0015 ounce, 0.05 gram Formosa MS SMA 0.185(4.8) 0.177(4.4) 0.012(0.3) Typ. 0.110(2.8) 0.094(2.4) 0.165(4.2) 0.150(3.8) 0.040(1.0) Typ. 0.067(1.7) 0.060(1.5) 0.040 (1.0) Typ. Dimensions in inches and (millimeters)MAXIMUM RATINGS
(AT TA=25oC unless otherwise noted) PARAMETER CONDITIONS Forward rectified current See Fig.2 Forward surge current 8.3ms single half sine-wave superimposed on rate load (JEDEC methode) Reverse current Thermal resistance Diode junction ca