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LP1072 - 802.11a/b/g Baseband System Solution

General Description

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16 6 Pinout and Footprint

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Key Features

  • pliance with 802.11a/b/g Ultra low power consumption, maximizing battery life and minimizing heat dissipation Ultra small package: 13.0 x 13.0 x 1.0 (max) mm Fully embedded ARM7TDMIā„¢ microprocessor for no load on the host processor, leading to maximum flexibility in supporting different host platforms Implementations of 802.11e Draft, for support of Quality of Service (QoS) real-time.

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Full PDF Text Transcription for LP1072 (Reference)

Note: Below is a high-fidelity text extraction (approx. 800 characters) for LP1072. For precise diagrams, and layout, please refer to the original PDF.

Freescale Semiconductor Advance Information Document Number: LP1072 www.DataSheet4U.com Rev. 0.3, 12/2005 LP1072 802.11a/b/g Baseband System Solution 1 1.1 Introduction T...

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/2005 LP1072 802.11a/b/g Baseband System Solution 1 1.1 Introduction The LP1070 Family Contents 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 Specifications . . . . . . . . . . . . . . . . . . . . . . . . . 3 3 Functional Description . . . . . . . . . . . . . . . . . 4 4 LP1072 Interfaces . . . . . . . . . . . . . . . . . . . . . 10 5 Timers/Reset . . . . . . . . . . . . . . . . . . . . . . . . . 16 6 Pinout and Footprint . . . . . . . . . . . . . . . . . . 17 7 DC Electrical Specifications . . . . . . . . . . . . 24 8 Timing Characteristics . . . . . . . . . . . . . . . . . 26 9 Mechanical Dimensi