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MC9S08SG16 - (MC9S08SG16 / MC9S08SG32) HCS08 Microcontrollers

General Description

of Changes Updated the TPM module, incorporated minor revisions for the Tj, PTxSE slew rate, FPROT and Appendix B packaging information.

-SAMPLES DRAFTQualify Draft includes updates to TPM module and the Electricals appendix.

Also, revised the order numbering information.

Key Features

  • 8-Bit HCS08 Central Processor Unit (CPU).
  • 40-MHz HCS08 CPU (central processor unit).
  • 36-MHz HCS08 CPU for temperatures greater than 125 °C.
  • HC08 instruction set with added BGND instruction.
  • Support for up to 32 interrupt/reset sources address and event-only data. Debug module supports both tag and force breakpoints Peripherals.
  • ADC.
  • 16-channel, 10-bit resolution, 2.5 μs conversion time, automatic compare function, temperature sensor, interna.

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Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

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MC9S08SG32 MC9S08SG16 Data Sheet Now Includes High-Temperature (up to 150 °C) Devices! HCS08 Microcontrollers www.DataSheet4U.com MC9S08SG32 Rev. 7 10/2009 freescale.com www.DataSheet4U.com MC9S08SG32 Series Features 8-Bit HCS08 Central Processor Unit (CPU) • 40-MHz HCS08 CPU (central processor unit) • 36-MHz HCS08 CPU for temperatures greater than 125 °C • HC08 instruction set with added BGND instruction • Support for up to 32 interrupt/reset sources address and event-only data. Debug module supports both tag and force breakpoints Peripherals • ADC — 16-channel, 10-bit resolution, 2.