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Freescale Semiconductor Data Sheet: Technical Data
Document Number: MPXC2011DT1 Rev. 11, 09/2015
MPXC2011DT1, 0 to 10 kPa, Differential, Compensated Pressure Sensor
Freescale Semiconductor has developed a high volume, miniature pressure sensor package which is ideal as a sub-module component or a disposable unit. The unique concept of the Chip Pak allows great flexibility in system design while providing an economic solution for the designer. This new chip carrier package uses Freescale Semiconductor's unique sensor die with its piezoresistive technology, along with the added feature of on-chip, thin-film temperature compensation and calibration.
MPXC2011DT1 Datasheet
