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Freescale Semiconductor Technical Data
MPXC2011DT1 Rev. 3, 10/2004
High Volume Sensor for Low Pressure Applications
Freescale Semiconductor has developed a low cost, high volume, miniature pressure sensor package which is ideal as a sub--module component or a disposable unit. The unique concept of the Chip Pak allows great flexibility in system design while allowing an economic solution for the designer. This new chip carrier package uses Freescale Semiconductor’s unique sensor die with its piezoresistive technology, along with the added feature of on--chip, thin--film temperature compensation and calibration.
MPXC2012DT1 Datasheet
