MPC560xC - (MPC560xB/C) Automotive Body and Gateway Applications

Product Overview

Freescale

Datasheet Details

Part number	MPC560xC
Manufacturer	Freescale
File Size	214.44 KB
Description	(MPC560xB/C) Automotive Body and Gateway Applications
Datasheet	MPC560xC Datasheet
Note	This datasheet PDF includes multiple part numbers: MPC560xC, MPC560xB. Please refer to the document for exact specifications by model.
Additional preview pages of the MPC560xC datasheet.

Product details

Description

JDP motherboard (P/N xPC56XXMB) + Mini-module (P/N xPC560BADPT144) (Soldered) Kits include main board, mini-module and P&E wiggler Mini-modules/kits available in socketed (~$450) and soldered (~$350) versions; Final production version will be soldered Mini-mo

Features

required to handle complex control and diagnostic systems. In addition, these scalable devices are supported by an enablement ecosystem that includes software drivers, operating systems and configuration code to help you quickly implement your designs.

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Published: Nov 4, 2008 |