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MPC560xC - (MPC560xB/C) Automotive Body and Gateway Applications

Download the MPC560xC datasheet PDF. This datasheet also covers the MPC560xB variant, as both devices belong to the same (mpc560xb/c) automotive body and gateway applications family and are provided as variant models within a single manufacturer datasheet.

General Description

JDP motherboard (P/N xPC56XXMB) + Mini-module (P/N xPC560BADPT144) (Soldered) Kits include main board, mini-module and P&E wiggler Mini-modules/kits available in socketed (~$450) and soldered (~$350) versions; Final production version will be soldered Mini-mo

Key Features

  • required to handle complex control and diagnostic systems. In addition, these scalable devices are supported by an enablement ecosystem that includes software drivers, operating systems and configuration code to help you quickly implement your designs.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (MPC560xB_Freescale.pdf) that lists specifications for multiple related part numbers.

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Other Datasheets by Freescale Semiconductor (now NXP Semiconductors)

Part Number Description
MPC560xB (MPC560xB/C) Automotive Body and Gateway Applications
MPC56x Reference Manual
MPC8245 Integrated Processor
MPC8548E Integrated Processor

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
Color Indicator Bar/Volume no. 32-bit Microcontrollers MPC560xB/C Family Automotive body and gateway applications Overview The MPC560xB/C family of 32-bit microcontrollers (MCUs) includes Freescale’s latest in integrated devices for automotive body electronics applications. The advanced, cost-efficient host processor core takes full www.DataSheet4U.