MURS220-LFR Overview
Key Features
- PLASTIC PACKAGE HAS UNDERWRITERS LABORATORY 94V-0
- IDEAL FOR SURFACE MOUNTED APPLICATION
- GLASS PASSIVATED CHIP JUNCTION
- BUILT-IN STRAIN RELIEF DESIGN
- ULTRA FAST RECOVERY TIME FOR HIGH EFFICIENT
- HIGH TEMPERATURE SOLDERING : 250 °C/10 SECONDS AT TERMINALS
- CASE: JEDEC DO-214AA MOLDED PLASTIC BODY, DO-214AA (SMB) DIMENSIONS IN INCHES AND (MILLIMETERS)
- TERMINAL: SOLDER PLATED, SOLDERABLE PER MIL-STD- 750 METHOD 2026
- POLARITY: COLOR BAND DENOTES CATHODE
