FPT-8P-M01
FPT-8P-M01 is SMALL OUTLINE L-LEADED PACKAGE manufactured by Fujitsu Semiconductor Limited.
FUJITSU SEMICONDUCTOR DATA SHEET
SMALL OUTLINE L-LEADED PACKAGE
8 PIN PLASTIC
8-pin plastic SOP Lead pitch Package width × package length Lead shape Sealing method Mounting height Weight 1.27 mm 5.3 × 6.35 mm Gullwing Plastic mold 2.25 mm MAX 0.10 g P-SOP8-5.3×6.35-1.27
(FPT-8P-M01)
Code (Reference)
..
8-pin plastic SOP (FPT-8P-M01)
- 1 6.35
- 0.20 .250
- .008
+0.25 +.010
Note 1)
- 1 : These dimensions include resin protrusion. Note 2)
- 2 : These dimensions do not include resin protrusion. Note 3) Pins width and pins thickness include plating thickness. Note 4) Pins width do not include tie bar cutting remainder.
- 0.04 .007
- .002
+0.03 +.001
INDEX
- 2 5.30±0.30 7.80±0.40 (.209±.012) (.307±.016)
Details of "A" part 2.00
- 0.15 .079
- .006
1 4
+0.25 +.010
(Mounting height)
"A" 0.13(.005)
0.25(.010) 0~8˚
1.27(.050)
0.47±0.08 (.019±.003)
0.50±0.20 (.020±.008) 0.60±0.15 (.024±.006)
- 0.05
+0.10 +.004
.004
- .002 (Stand...
