MBM29DL32xTD Datasheet

Manufacturer: Fujitsu Semiconductor Limited

This datasheet includes multiple variants, all published together in a single manufacturer document.

Datasheet Details

Part number	MBM29DL32xTD
Datasheet	MBM29DL32xTD MBM29DL32xBD Datasheet (PDF)
File Size	1.59 MB
Manufacturer	Fujitsu Semiconductor Limited
Description	32M (4M X 8/2M X 16) BIT Dual Operation

FUJITSU SEMICONDUCTOR DATA SHEET DS05-20873-4E FLASH MEMORY CMOS 32M (4M × 8/2M × 16) BIT Dual Operation MBM29DL32XTD/BD.

80/90/12
0.33 µm Process Technology
Simultaneous Read/Write operations (dual bank) Multiple devices available with different bank sizes (Refer to Table 1) H
Single 3.0 V read, program, and erase Minimizes system level power requirements
80 80 30
90 90 90 35
12 120 120 50
patible with JEDEC-standard mands Uses same software mands as E2PROMs
patible with JEDEC-standard world-wide pinouts 48-pin TSOP(I) (Package suffix: PFTN
Normal Bend Type, PFTR

Part Number	Description	Other Manufacturers
MBM29DL321BD-12	32M (4M x 8/2M x 16) BIT Dual Operation	Fujitsu
MBM29DL321BD-80	32M (4M x 8/2M x 16) BIT Dual Operation	Fujitsu
MBM29DL321BD-90	32M (4M x 8/2M x 16) BIT Dual Operation	Fujitsu
MBM29DL321TD-12	32M (4M x 8/2M x 16) BIT Dual Operation	Fujitsu
MBM29DL321TD-80	32M (4M x 8/2M x 16) BIT Dual Operation	Fujitsu

Part Number	Description
MBM29DL32xTE	(MBM29DL32xTE/BE) FLASH MEMORY CMOS 32 M (4 M X 8/2 M X 16) BIT
MBM29DL32xBD	32M (4M X 8/2M X 16) BIT Dual Operation
MBM29DL321BD	(MBM29DL32xBD) 32M (4M X 8/2M X 16) BIT Dual Operation
MBM29DL321TD	(MBM29DL32xBD) 32M (4M X 8/2M X 16) BIT Dual Operation
MBM29DL322BD	(MBM29DL32xBD) 32M (4M X 8/2M X 16) BIT Dual Operation
MBM29DL322BE	(MBM29DL32xTE/BE) FLASH MEMORY CMOS 32 M (4 M X 8/2 M X 16) BIT
MBM29DL322TD	(MBM29DL32xBD) 32M (4M X 8/2M X 16) BIT Dual Operation
MBM29DL322TE	(MBM29DL32xTE/BE) FLASH MEMORY CMOS 32 M (4 M X 8/2 M X 16) BIT
MBM29DL323BD	(MBM29DL32xBD) 32M (4M X 8/2M X 16) BIT Dual Operation
MBM29DL323BE	(MBM29DL32xTE/BE) FLASH MEMORY CMOS 32 M (4 M X 8/2 M X 16) BIT