FPT-208P-M06 Datasheet PDF

FUJITSU SEMICONDUCTOR DATA SHEET LOW PROFILE SHRINK QUAD FLAT L-LEADED PACKAGE 208 PIN PLASTIC To Top / Package Lineup / Package Index FPT-208P-M06 208-pin plastic LQFP Lead pitch Package width × package length Lead shape Sealing method 0.50 mm 28 × 28 mm Gullwing Plastic mold (FPT-208P-M06) 208-pin plastic LQFP (FPT-208P-M06) 30.00±0.20(1.181±.008)SQ 28.00±0.10(1.102±.004)SQ 156 105 1.70(.067)MAX. (Mounting height) "A" 104 157 0.08(.003) Details of "A" part 0.25(.010) 1.70(.067)MAX. (Mounting height) INDEX 208 53 0~8° 0.45/0.75 (.018/.030) 0.10±0.05 (.004±.002) (Stand off) LEAD No. 1 52 0.50(.0197) TYP 0.22 –0.04 .009 –.002 +0.05 +.002 0.08(.003) M 0.145 –0.03 .006 –.001 +0.05 +.002 C 1997 FUJITSU LIMITED F208027S-1C-1 Dimensions in mm (inches). The contents of this document are subject to change without notice. Customers are advised to consult with FUJITSU sales representatives before ordering. FUJITSU is unable to assume responsibility for infringement of any patent rights or other rights of third parties arising from the use of the information or package dimensions in this document.