Fujitsu FPT-64P-M09
LOW PROFILE QUAD FLAT PACKAGE 64 PIN PLASTIC
FUJITSU SEMICONDUCTOR DATA SHEET LOW PROFILE QUAD FLAT PACKAGE 64 PIN PLASTIC FPT-64P-M09 64-pin plastic LQFP Lead pitch Package width × package length Lead shape Sealing method Mounting height Code (Reference) 0.65 mm 12 × 12 mm Gullwing Plastic mold 1.70 mm MAX P-LQFP64-12×12-0.65 (FPT-64P-M09) 64-pin plastic LQFP (FPT-64P-M09) Note 1) * : These dimensions do not include resin protrusion. Note 2) Pins width and pins thickness include plating thickness. Note 3) Pins width do not include tie bar cutting remainder. 14.00±0.20(.551±.008)SQ * 12.00±0.10(.472±.004)SQ 48 33 0.145±0.055 (.0057±.0022) 49 32 0.10(.004) Details of "A" part 1.50 –0.10 .059 –.004 +0.20 +.008 (Mounting height) 0.25(.010) INDEX 0~8˚ 64 17 1 16 "A" 0.65(.026) 0.32±0.05 (.013±.002) 0.50±0.20 (.020±.008) 0.60±0.15 (.024±.006) 0.10±0.10 (.004±.004) (Stand off) 0.13(.005) M C 2003 FUJITSU LIMITED F64018S-c-3-5 Dimensions in mm (inches). Note: The values in parentheses are reference values. The contents of this document are subject to change without notice.