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EQW025 - Eighth-Brick Power-Modules

Download the EQW025 datasheet PDF. This datasheet also covers the EQW012 variant, as both devices belong to the same eighth-brick power-modules family and are provided as variant models within a single manufacturer datasheet.

Description

Industry standard Eight brick footprint 57.9mm x 22.8mm x 8.5mm(MAX) (2.28in x 0.9in x 0.335in) Constant switching frequency Remote On/Off Positive logic (primary referenced) Remote Sense Adjustable output voltage ( 10%) Output overvoltage and overcurrent protec

Features

  • Compliant to RoHS EU Directive 2011/65/EU (Z versions).
  • Compliant to RoHS EU Directive 2011/65/EU under exemption 7b (Lead solder exemption). Exemption 7b will expire after June 1, 2016 at which time this produc twill no longer be RoHS compliant (non-Z versions).
  • Delivers up to 25A Output current.
  • High efficiency.
  • 91% at 5.0Vdc full load (Vin=48Vdc).
  • Low output ripple and noise.
  • Surface mount or through hole.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (EQW012-GE.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number EQW025
Manufacturer GE
File Size 915.86 KB
Description Eighth-Brick Power-Modules
Datasheet download datasheet EQW025 Datasheet

Full PDF Text Transcription

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GE Data Sheet EQW012/020/023/025 Series, Eighth-Brick Power Modules 36 - 75Vdc Input; 1.2Vdc to 5Vdc Output; 12A to 25A Output RoHS Compliant Features  Compliant to RoHS EU Directive 2011/65/EU (Z versions)  Compliant to RoHS EU Directive 2011/65/EU under exemption 7b (Lead solder exemption). Exemption 7b will expire after June 1, 2016 at which time this produc twill no longer be RoHS compliant (non-Z versions)  Delivers up to 25A Output current  High efficiency – 91% at 5.0Vdc full load (Vin=48Vdc)  Low output ripple and noise  Surface mount or through hole Applications  Distributed power architectures  Wireless Networks  Enterprise Networks  Optical and Access Network Equipment  Latest generation IC’s (DSP, FPGA, ASIC) and Microprocessor powered applications.
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