MB6F Datasheet | Galaxy Microelectronics

FEATURES z Glass：passivated chip junctions z High surge overload rating: 30A peak Pb Lead-free z Saves space on printed circuit boards z High temperature soldering guaranteed: 260°C/10 seconds at 5 lbs. (2.3kg) tension MECHANICAL DATA z Case: Molded plastic body over passivated junctions z Terminals: Plated leads solderable per MIL-STD-750, Method 2026 Maximum Ratings (@TA = 25°C unless otherwise specified) Characteristic Symbol MB4F MB8F Peak Repetitive Reverse Voltage RMS Reverse Voltage DC Blocking Voltage Maximum average forward Output current @TA=25℃ Peak forward surge current 8.3ms single half-sine-wave superimposed on rated load VRRM VRMS VDC IF(AV) IFSM 400 280 400 600 800 420 560 600 800 Thermal Characteristics Characteristic Typical junction capacitance per leg (NOTE 1) Operating junction temperature range Storage temperature range Symbol CJ TJ TSTG MB4F MB8F -...