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Production specification
Surface mount zener diode
FEATURES
z Planar die construction.
z 500mW power dissipation.
Pb
Lead-free
z General purpose, medium current.
z Ideally suited for automated assembly processes.
MMSZ2V4-MMSZ56
APPLICATIONS
z Zener diode.
z Ultra-small surface mount package.
ORDERING INFORMATION
Type No.
Marking
MMSZ2V4-MMSZ56
See table 2
SOD-123
Package Code SOD-123
MAXIMUM RATING @ Ta=25℃ unless otherwise specified
Characteristic
Symbol
Value
Forward Voltage Power Dissipation
@ IF=10mA
VF Pd
0.95 500
Thermal resistance,junction to ambient air
RθjA
340
Junction temperature
Tj 150
Storage temperature range
Tstg -55 to +150
Unit V mW ℃/W ℃ ℃
A018 Rev.A
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MMSZ2V4 Datasheet
